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Top 5 of No-clean Solder Paste

Top 5 of No-clean Solder Paste

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Hi, Actually, we want to run a benchtest for solder paste... - Mar 01, 2005 by ING

Indium NC SMQ92J for both lead and unleaded ... - Mar 01, 2005 by RDR

Cookson solder paste 256 seem to be a good and very active n... - Mar 02, 2005 by

Russ, are you using any reduction on your stencil aperatures... - Mar 02, 2005 by adlsmt

I like Alpha Metals OM-5100. Very long stencil life with go... - Mar 02, 2005 by

We use 10% reductions when either the aspect or area ratio w... - Mar 02, 2005 by RDR

we use SENJU M705. type3 solder paste. Has a good shelf life... - Mar 02, 2005 by

We also use Indium NC-SMQ92J. We do the same as mentioned pe... - Mar 03, 2005 by gpaelmo

We use Alpha UP-78 (Older paste formula) and it works well f... - Mar 04, 2005 by jbrower

Top 5 of No-clean Solder Paste | 1 March, 2005

Hi,

Actually, we want to run a benchtest for solder paste to verify if the paste we use is one of the best.

So, with your experiments and tests, what's the top 5 for No-clean solder paste?

* I mean leaded solder paste ( for the moment) :)

Top 5 of No-clean Solder Paste | 1 March, 2005

Indium NC SMQ92J for both lead and unleaded

GV

Top 5 of No-clean Solder Paste | 2 March, 2005

Cookson solder paste 256 seem to be a good and very active no clean solder paste. We have some good experience. We did not bother to evaluate oters since we have had good results with this solder paste. May be you can try. Most important is the reflow profile also.

Top 5 of No-clean Solder Paste | 2 March, 2005

Russ, are you using any reduction on your stencil aperatures? How much for what type of parts? We seem to have to many problems with resistor network aperatures clogging. How well does this paste release from small aperatures?

jdengler

Top 5 of No-clean Solder Paste | 2 March, 2005

I like Alpha Metals OM-5100. Very long stencil life with good results.

Jerry

Top 5 of No-clean Solder Paste | 2 March, 2005

We use 10% reductions when either the aspect or area ratio will not be affected. We will utilize a 1:1 when necessary. We place a lot of those little Rnets down to 0805 size .5mm pitch and do not see any problems. We use 6 mil stencils almost exclusively. When the pad design for these is not optimum we will use a 5 mil when and if possible. I don't know how but there seems to be alot of bad designs for these from both the Mfgr. and designers. These pads really need to be designed for the stencil and not "adequate fillet requirements". I will send you the pad dimensioning for these that we have found to be trouble free once i can round them up.

Russ

Indy

Top 5 of No-clean Solder Paste | 2 March, 2005

we use SENJU M705. type3 solder paste. Has a good shelf life.

This message was posted via the Electronics Forum @

Top 5 of No-clean Solder Paste | 3 March, 2005

We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might want to check your stencil design to make sure it meets aspect ratio requirements. We use 6 mil, 5mil, and 4 mil stencils; depends on how much we need to reduce apertures and still be within aspect or area ratio requirements.

Gus

Top 5 of No-clean Solder Paste | 4 March, 2005

We use Alpha UP-78 (Older paste formula) and it works well for what we do. We standardized our stencils at 5mil with a 10% reduction on IC apetures and a home plate design on passive components. Additionally we use laser cut electro-polished stencils.

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