Low end selective laser soldering systems are limited to what types of soldering can be performed. I have read through the previous comments and find that most have commented on earlier technologies (which do not offer the features today's system do). To address a few points, here are features you want and the reasons why: 1) Variable Beam Size - this allows you to target the pad to the exact size, pin to pin (through software). Ranges are generally from .9 to 2.5 mm (on the fly) 2) Dynamic compensation - with fiducial recognition and dynamic compensation pads can be located and soldered every time with a very high degree of accuracy. This feature is highly recommended. 3) Auto solder feeder with Geyan feed system - this system perforates the solder wire as it is being fed to allow the fumes to escape freely during the melting process. Otherwise splatting can occur. 4) Independant X, Y Z and Theta movement between soldering head and solder feeder. This allows you total flexibility when soldering components that may have obstructions in the soldering path.
Preheat is a value point but only for those products that have thermally challenged planes. Most laser soldering systems allow you to select a lower initial power setting (preheat) before going to full power for soldering.
A few other notes: Start up is $35 (a spool of wire) vs $20-30K for a bath of solder. Maintenance is once every 4 hours and generally takes 5-6 minutes. Laser self calibrate (at least most do) and are air cooled so no nitrogen is required.
Hope this helps.
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