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we are observing voids in solder ball bonding process using ... - Mar 01, 2006 by Ajay
Ajay
#40094
Voids | 1 March, 2006
we are observing voids in solder ball bonding process using laser.Final metal finish is of Au on Cu.Can anyone tell me the reasons or solution for this problem.We are not using any flux at all.
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