This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coatings on ICT [that you may or may not care about].
That article focused on SnPb HASL. Your customer chose a lead free HASL like: http://www.aimsolder.com/techarticles/No-Lead%20and%20Horizontal%20Hot%20Air%20Leveling.pdf
We have no relationship, nor receive benefit from the company referenced above.
Q1: Is there anything from solderpaste-reflow soldering that we need to think about? A1: From solderpaste-reflow standpoint, your new HASL boards will probably not have pads as flat as the boards with ENIG that you're used to processing. This will have impact below 20 pitch. Q2: Is there anything from the selective soldering that we need to think about? A2: No Q3: Is there anything from the hand soldering that we need to think about? A3: No
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