Thanks for replying Mr BoardHOuse.
The product has to be RohS compliance. Surface finished is something that I am still considering and currently looking at either OSP or Immesion Silver. In short whatever combination that can produce high reliability solder joint/product? Example: will Sn95Ag5 be the right alloy to use? WIll ceramic be the best fit? Underfill material get brittled under extreme low temp?
I have not decided on the layer yet as we are still at a very beginnig stage. At this stage, if I consider ceramic, what is the cost associated to structure it in a Multilayers form? If I can find material that can stands low -90Deg C and can be processes at high 260 Deg C and cost in multilayering it is cheaper, then I would consider that.
Please let me know if further information is required. Again thank you for responding. It was much appreciated.
cheers..
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