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We are using a glue and wave solder process for primarily c... - Feb 23, 2000 by John Sims
John Sims
#1813
Placement Defect Rate Benchmark | 23 February, 2000
We are using a glue and wave solder process for primarily chip components. Our products do not use any fine pitch components. What would an acceptable benchmark for the placement defect rate be? 50 DPMO? 100 DPMO? 200 DPMO?
Thanks in advance,
John
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