Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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We are using a vapor phase oven which we have used successfu...
- Aug 21, 2009
by
ross
Dear Eric,
in my opinion this is a very complex problem, ...
- Aug 22, 2009
by
Edoardo
Thank you for replying.
1) the finish is Gold Immersion (EN...
- Aug 22, 2009
by
ross
OK Eric, is difficult answer at distance without examine t...
- Aug 23, 2009
by
Edoardo
I don't think its an issue with the PCB. When we just put th...
- Aug 24, 2009
by
ross
OK Eric, maybe you're right. My suggestion is to proceed by ...
- Aug 24, 2009
by
Edoardo
Thank You for all your help.
The PCBs are from the same ven...
- Aug 24, 2009
by
ross
Eric, use the TM 650 test method annexed.
Don't forget to...
- Aug 25, 2009
by
Edoardo
It sounds like the BGA balls are not melting. You're probabl...
- Aug 25, 2009
by
davef
Do you know the exact BGA sphere alloy make-up and the alloy...
- Aug 25, 2009
by
Graham
Eric, the problem is a crack of the nickel PAD, or is a PILL...
- Aug 25, 2009
by
Edoardo
It appears that the crack is between the paste and the ball....
- Aug 25, 2009
by
ross
The solder balls on this part are SAC105 (98.5 Sn, 1.0 Ag, 0...
- Aug 25, 2009
by
tstrat
Hi, as you are using Vapour phase reflow what temperature is...
- Aug 26, 2009
by
Graham
Ok Eric, finally we know that the problem should be the PI...
- Aug 26, 2009
by
Edoardo
I am not sure that it is the pillow problem. With the pillow...
- Aug 26, 2009
by
ross
I have already told you that is not possible solve this prob...
- Aug 27, 2009
by
Edoardo
Thank You for all your help.
Eric
...
- Aug 27, 2009
by
ross
We recently had a very similar issue with BGA breaking off a...
- Aug 27, 2009
by
JIMnHKY
Thanks Jim.
Can you tell me how you resolved/corrected th...
- Aug 27, 2009
by
ross
What is the boiling point of your vapour phase solvent ?
...
- Aug 31, 2009
by
Graham
We have tried 2.
The first is 244C and the 2nd is 252C.
Th...
- Aug 31, 2009
by
ross