Hi Walter, Do you refer to a sprayfluxer operation? The problem seems to be a parameter setting issue. 1. Ensure the wide angle spray reaches PCB with optimum jet pressure. You could pass a glass plate to understand flux coverage and view Jet pressure. 2. Synchronise Nozzle motion with PCB speed to avoid/minimise fluxing overlap on board. 3. If operated under track mode, verify the track sensor timing on machine. Some machines have a PLC that needs to be programmed to synchonize conveyor speed, Fluxing duration, and solder wave activation. 4. Check the performance of the exhaust system near fluxer. Any flux that penetrates through open via or large PTH should be sucked away from the board. This prevents/reduces flux residue deposition on top side of PCB.
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