Hello all,
One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
The first time this happened was on the bottom of the board ( 2 reflow cycles). The board was in test, and a tech lightly poked the package and it separated. The second time was a top-side component (single reflow), and the package was bumped while changing out a nearby part and the package came off (again, the balls are firmly attached to the PCB, and the BGA pads look bare).
We are using a leadfree solder. We do not currently have xray inspection in-house, as our BGA usage is VERY low. Our source for inspecting our boards didnt see anything wrong, but I'm not sure they were looking at this part of the BGA (probably focusing on where the ball meets the PCB).
Any ideas what to look at here? Is this a manufacturer defect? Handling? Profile issue? Any input is appreciated. Thanks
Edit: In looking very closely under the scope, it appears there is some solder on the BGA's pads. The PCB definitely has the ball-shaped part soldered to it though.
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