We have a Large LGA package (40mm X 40mm) that we are trying to process on a double-sided assembly. problem is the only space we have for it is on 1st side processing side. Therefore we have worries about falling off in the oven during the 2nd side reflow cycle. Does anyone have experience with using underfill or other methods to alleviate this issue ? or are we stuck having to find room to place this large component on 2nd side processing side ?
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