We are experiencing a high incidence of what we call "black barrel" (to differentiate from black pad) with multiple contract manufacturers and PCB vendors. The PCBs are ENIG and during wave solder (SACX-0307) multiple thru-hole components are seeing random solderability.
I have seen the issue referred to as "Black Tarr" on the defects database with out suggested resolution. There are good pictures of the issue, just search "black tarr":
http://defectsdatabase.npl.co.uk/defectsdb/defects_query.php
Does anyone have any insights on this one?
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