Hello Guru's,
I am using IPC-7351 LP Calulator to design Footprint (0603, 0805, 1206, SOT-23, etc) for all SMT Parts.
Our Production Recently commented that they have included Red Glue Machine inhouse and will use Wave Soldering for Both Thru-hole and SMT Parts.
and complaint about Footprints needs to be modified (increase pad sizes)for all SMT Part to get good solder quality during wave soldering.
1. Can you Please provide Guildlines to Design All types of Footprint for Wave Soldering and Reflow Process ? 2. is IPC Calculator is not sufficient for both type of soldering ?
Thanks alot inadvanced..! i really need help on this.
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