Our customer wants to do an overmold operation (3rd party to us) on the non-populated side of a rigid flex assembly. Their inquiry below:
"We are going to end up over molding plastic over the back of this rigid flex to form an enclosure but wanted to ensure that the backside (non component side) can withstand temps of 300°F of hot plastic and 18,000 PSI of mold flow pressures? Let me know if you can help me find out if this or how this can be done without frying or breaking the board."
I see the heat being a potential issue for the polyimide flex if not pre-baked. As far as the pressure, I have no idea how to respond. Any thoughts?
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