Hello,
I am looking into the use of a Samtec SEAM-50-02.0-L-10-2-A-GP-K-TR on a board. Is anyone around who has experience with this component?
Specifically, we are looking for design advice for stenciling and soldering. The component is a solder charge component and the pads for this component are 25 mils (50 mil pitch). The recommended stencil opening is 35 mils in a 6 mil thick stencil. The problem is we may need to use a 5 mil stencil based on other components on the board (which could necessitate making the stencil openings even wider to get as much solder to the charges).
Based on your experience, does this component really need to be overpasted as much as is recommended? Also, if anyone has had to use a 5 mil stencil, how much wider would you make the apertures? Finally, does anyone have any additional tips for using this component?
I appreciate any help you can offer.
Related Links:
Spec: http://www.samtec.com/ftppub/prodspec/seam-seaf.pdf
Catalog: http://cloud.samtec.com/catalog_english/seam_gp.pdf
Recommended footprints: http://www.samtec.com/ftppub/cpdf/seam-xx-xx.x-xx-xx-x-xx-footprint.pdf
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