I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of 25% .The parts have termination with grayish look , vendor is murata which is saying that part need to be soldered at higher temp or longer dwell time to make a good solder joint. Low residue soldering method is used. I am asked to touch up all those joints and add solder to meet min requirement of 25% fillet height. I am looking for suggestions how such a dauting task can be completed ? What is most recommended method for touching up solder joints ? - flux and reflow -remove and replace -talon tweezers -hot gas tips ? - ????
I will appreciate feedback from you how we can proceed further this ?
I guess Rev C does not require fillet height to be 25%. I do not know why IPC chnaged to
reply »