Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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Hello, I was at a IMAPS conference last year 2016 and sev... - Mar 14, 2017 by PZappella
I don't have an answer but I am curious. What data/testin... - Mar 14, 2017 by Sr. Tech
I've always been happy with ~25% or less combined voiding on... - Mar 14, 2017 by dontfeedphils
@ Sr.Tech, Any voiding means that the part of the package... - Mar 15, 2017 by Robl
Rob, That's what I suspected but I would be interested to... - Mar 15, 2017 by Sr. Tech
It's well documented in higher power semiconductors where th... - Mar 15, 2017 by Robl
From what I know, you should follow IPC standard for the cla... - Mar 15, 2017 by Evtimov
Hi Etimov, Understood that to us assembling parts that IP... - Mar 15, 2017 by Robl
Hello, A speaker at the conference is where I heard that ... - Mar 15, 2017 by PZappella
Hi Phil, 25% sounds real high to me, any failures availab... - Mar 15, 2017 by PZappella
Hello Rob, I totally agree with you. Is this a real pr... - Mar 15, 2017 by PZappella
Hi PZ, What, sort of like this one? ... - Mar 15, 2017 by Robl
Rob, I believe that is for die attach voiding not solder in... - Mar 15, 2017 by Sr. Tech
Rob, Absolutely agree. Customer precedes standard. As you m... - Mar 15, 2017 by Evtimov
Customer precedes standard, but customer must be educated an... - Mar 15, 2017 by Sr. Tech
It's the same thermal issue whether it's a die or package. ... - Mar 16, 2017 by Robl
Hi Rob, Thanks for the LED paper. I like the void area ... - Mar 16, 2017 by PZappella
I think the main driver is MTBF data driven by the Car OEMS,... - Mar 17, 2017 by josh
In IPC it is said that the void % should be established betw... - May 31, 2017 by Buckcho
Hi, please go through IPC 7093, its only for design and asse... - Apr 28, 2018 by Shuhaib uv
In the past I have worked on 600 Amp FET Blocks. The rule wa... - May 01, 2018 by sarason