My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product.
1. Is there any long term reliability issues with 2% Ag in BGA Ball.
2. If the PCB finish is ENIG will there be degradation in the reliability.