SMD Moisture Sensitive Devices - Baking using vacuum-bake oven - seeking clarification

Hello, I have searched the forums for this specific topic, but can not find the clarification I would like.

I am setting up a baking system to "reset" SMD components using a vacuum-bake oven. According to the JEDEC-STD-033 standard, depending on the thickness of the component, the bake time will vary. I am interested in setting a vacuum-bake oven to 40°C and %RH<5%. I have already learned I can't use a standard non-vacuum oven, because the %RH still hovers around 20%, depending on the environmental conditions. So, I will use a vacuum oven because I know the chamber will be less than 5%RH (I tested it out).

In another very old thread on this forum, a forum member wrote," OVEN + VACUUM By using an oven with vacuum, you can dry-off relays by setting temperature at 45-50C , and a not so high vacuum level ( ie. 350 mmHg can be enough, more vacuum value could damage the Carrier Tape and component leads) for about 12-24 hours. In this case no matter about plastic material (Carrier Tape and Reel)" I am not using a relay, but transistors and tantalum caps.

Questions: I realize the above was a general statement, because bake times depend on component thickness. However, does a vacuum bake decrease the overall bake time, even though the %RH is <5%, i.e. the JEDEC-STD-033 doesn't mention anything about the type of oven to use, but I am assuming that <5%RH doesn't matter whether it was obtained using a standard oven or vacuum oven. You just need to be under 5%RH and then bake at the times indicated in table 4-1.

1) Does using a vacuum bake enable me to reduce the bake time, (40°C, and <5% RH) or does it remain according to the bake times in the JEDEC-STD-033A? If so, then what's a R.O.T to reduce the bake time?

2) Is there a maximum vacuum that should be used to prevent damaging components or reel or lamination? Thank you for your consideration. John

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