Hi All,
Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON.
Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Parameter Settings on the Reflow Oven) specially for each PCB.
As of now we are trying to create a software that uses the past settings of each Recipe and cross comparing the new PCB we have according to the Past PCB(Which already has a recipe for itself) to recommend us the best suited settings to use.
The Cross Comparing Parameters will be: 1. PCB Length, Thickness and Width 2. Layer Counts of PCB 3. Copper plane ounce and volume 4. Bare PCB's Weight and PCB with Components mounted weight
As this has got to do with Thermal transfer, i would like to ask the community if there is any other parameter which i should take into account when cross comparing the new PCB with another PCB(of different design but similar in parameters) which has been assembled before.
The aim of the software is to match my New PCB with one PCB that has been assembled before and return me the Parameter Settings for that matched PCB
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