Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

SMTnet
»
Electronics Forum
»
pad soderbility problem

pad soderbility problem

Subscribe to Thread

hello can anyone help me what might cause the problem for so... - Dec 12, 2024 by vasu

check if there are vias in the pads. you have not uploaded a... - Dec 12, 2024 by Wippsen

check solderability PCB ... - Dec 12, 2024 by Dima

Referencing the photos, there appears to be some vias near p... - Dec 12, 2024 by charliem

It's getting sucked into via holes. You could mask the other... - Dec 12, 2024 by Auriga2001

thanks you for all your input i will followup with the desig... - Dec 14, 2024 by vasu

If you are unable to change the FAB design anytime soon, the... - Dec 16, 2024 by Thomas

Clearly the solder is flowing away in the via holes. Unless ... - Dec 17, 2024 by MagyarT

vasu

#91665

pad solderbility problem | 12 December, 2024

hello can anyone help me what might cause the problem for some pads paste deposit is missing i checked reflow profile and paste deposit on pcb

Attachments:

reply »

Wippsen

#91667

pad solderbility problem | 12 December, 2024

check if there are vias in the pads. you have not uploaded a picture of the unprinted circuit board

reply »

Dima

#91668

pad solderbility problem | 12 December, 2024

check solderability PCB

reply »

charliem

#91669

pad solderbility problem | 12 December, 2024

Referencing the photos, there appears to be some vias near pads that are only partially covered with soldermask. This may allow solder to flow down the plated via and scavenge solder off the pad.

reply »

Auriga2001

#91670

pad solderbility problem | 12 December, 2024

It's getting sucked into via holes. You could mask the other side of the board and/or add more solder.

reply »

vasu

#91671

pad solderbility problem | 14 December, 2024

thanks you for all your input i will followup with the designer

reply »

Thomas

#91672

pad solderbility problem | 16 December, 2024

If you are unable to change the FAB design anytime soon, then you should try to modify the stencil design to try to keep the solder paste away from the vias.

reply »

MagyarT

#91673

pad solderbility problem | 17 December, 2024

Clearly the solder is flowing away in the via holes. Unless that solder is creating test failures, I don't understand how this is a problem if there are no components present.

Regards, Tom

reply »