SIL Package, 8-Pin μSIP

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Hi all, We are seeing solder beading on the sides of his pa... - Apr 30, 2026 by aj

Although a 130 µm solder die is typical, your SPI data indic... - May 07, 2026 by tropicalfuelpum

Your SPI shows consistent overprint, and for µSIP/QFN parts ... - Jun 13, 2026 by Benjamin Rodriguez

#92744

SIL Package, 8-Pin μSIP LMZ10501 | 30 April, 2026

Hi all,

We are seeing solder beading on the sides of his part after reflow.

Stencil , placement all checks out fine.

We have SPI , stencil is 130um but results read 160-180um but we are told this is standard results.

welcome any comments to try prevent the

solder seeping out of the sides... or is it possible? LMZ10501 part number

thanks

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tropicalfuelpum

#92758

SIL Package, 8-Pin μSIP LMZ10501 | 7 May, 2026

Although a 130 µm solder die is typical, your SPI data indicates excess solder paste (~20–40% higher). For QFN/µSIP type packages like the LMZ10501, the excess solder paste often has nowhere to escape during the remelting process and is &quot;pushed out&quot; to the sides → forming particles.

Possible solutions for you include reducing the vent hole area. Consider using window/segment vent holes for the heat sink contact. Narrow the printing process range (pressure, free top games die separation, cleaning frequency).

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Benjamin Rodriguez

#92798

SIL Package, 8-Pin μSIP LMZ10501 | today at 07:40 AM

Your SPI shows consistent overprint, and for µSIP/QFN parts like LMZ10501 that usually leads to solder beading due to excess paste escaping the edges of the thermal pad. I would try reducing paste volume on the center pad (aperture reduction/windowing) and check paste release efficiency rather than only relying on stencil thickness.

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Benjamin Rodriguez

#92799

SIL Package, 8-Pin μSIP LMZ10501 | today at 07:40 AM

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