| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack,
The dip component package material and the packaging process is the same as that used to manufacture SMT parts so should be fine.
Just be sure to print sufficient paste to ensure a good fill of the PTH's. The DIP leads don't fill much of the hole volume so a good amount of paste will be required.
By the way does anyone else have much experience of reflowing through hole components (apart from connectors)???
Good luck
Pete B.
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