| I've been asked to put together a "Technology Road Map" that shows the direction components (technology) and the equipment that places them might be taking for the next 10 years. For instance, micro BGA might require more sophisticated pick-and-place equipment than a 50 mil BGA. Does anyone have any insight as to where technology might be leading us with regards to components and placement equipment? | Jag: Check:
National Electronics Manufacturing Initiative, Inc. 2214 Rock Hill Road, Suite 110 Herndon, VA 20170-4214 703-834-0330 Fax: 703-834-2735
reply »