Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)]
* Baking time and temperature if using a Vacuum Drying Cabinet and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) - We�ve talked about bake time and temperature before in the fine SMTnet Archives, but I believe this most often applied to FR-4, not to polyimide. - For polyimide, your fabricator can probably give you recommendations, but probably the best measure is the results of the weight loss experiments that you can perform during the baking of your boards.
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