flip-chip

We are writing to have information about the automatic mounting process of flip-chip. We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). Thanking you in advance we hope to receive an answer as soon as possibile. Yours Faithfully Aselco electronics .

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:I believe it can be easily done using the universal GSM platform. You may want to contact Universal instruments corp. in Binghamton NY for further information. We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking you in advance we hope to receive an answer | as soon as possibile. | Yours Faithfully | Aselco electronics .

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| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking you in advance we hope to receive an answer | as soon as possibile. | Yours Faithfully | Aselco electronics . Aselco Electronics: Help me understand better what you want to accomplish: 1 Are you trying to get responses from TDK and/or Samsung placement machine users on their experience using those machines to place flip chips? If so, you might ask your factory representative(s) for the names of their customers who are using their machines to place flip chips. 2 Are you trying to determine if placement machines are capable of placing flip chips? If so, "standard" placement machines can not flip chips. Many "standard" placement machines (given some limitations on pitch), including the UIC GSM that Jim mentioned, can place flipPED chips. Other placement machines that can place flipPED chips are: Quad QSV, Zevatech FM740, and Philips Emerald. 3. Something else?? Dave F

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What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place. GSM spec gives repeatibility not absolute placement accuracy. At 25micron absolute placement accuracy you can place a 250 micron pitch with 3 sigma reliability. | We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking you in advance we hope to receive an answer | as soon as possibile. | Yours Faithfully | Aselco electronics .

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