| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint strength relate to 0.3um depth of contact. assuming same contact area, shape etc. I am not really interested in what is good or bad, more the relationship. | Thanks I know your concern but, working where you do - with all your resources, I must wonder what strength measurement you need. Is it shear, tensile, cycles to failure, or what am I missing? Like to help as we used to do all this testing for leadless military product but don't know anyone (maybe unfortunately) even interested in leaded device types. I'd sure like to know more about data concerning BGA and micro BGA. Good hunting or testing, Earl Moon
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