| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have not heard from them. | The pattern is not in our IPC-SM-782 book. I used their calulater program, from the web page, to create a patten, but have not heard from IPC either. If the 112 TQFP has a .65mm lead pitch, .32mm lead width, and the outside toe to toe dimension is 22mm, you would use a PCB pad width of .38mm, pad length of 1.8mm, and the outside pad toe to toe dimension would be 22.8mm. If you need further information on PCB pad geometries, or any questions on solder joint interconnect issues please call me at 512-933-5783, or email ra0528@email.sps.mot.com. You can also call the Motorola Customer Applications Support hot line at 512-933-7289. Regards, Terry Burnette.
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