Available now: HP/FourPi 3DX Model 3500G system, using cross-sectional X-ray imaging to inspect solder joints on printed circuit boards. If interested, please contact matti.maatta@fujitsu.fi
Hello All, Just as a side note, we've got one in use in the PCMCIA line at the Technological Advancement Center lines here at NEPCON West 98...after watching it at work, I gotta say, I'm impressed! We're using it to inspect BGA, Micro BGA, 15.7-mil QFP, and passive component joints down to 0402...pretty slick! We'll be using it over the next 2-days. -Steve Gregory-