Hi there.
We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run product through. The solder joints looked acceptable, however we found that the boards had solder balls around the pads of one part and one part only.
The part that exhibited the problem has leads with a Palladium/ Nickel finish. We know that the printing was not an issue, and there are other parts of similar size and pitch on these boards.
My question is... would parts with this Palladium finish for any reason be more prone than normal parts to giving solder balls in an out of control oven.
Cheers, Dave.
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