Here's some papers: * �Voiding Of Lead-Free Soldering At Microvia�; Dr. Hyoryoon Jo, B. Nieman, and Dr. N.C. Lee Indium Corporation of America; SMTA International; 09/22/2002 * �Solder Joint Formation With Sn-Ag-Cu And Sn-Pb Solder Balls And Pastes�; Polina Snugovsky et al. Celestica International Inc.; SMTA International; 09/22/2002 * �Evaluating The Effects Of Reflow Profile Control On Solder Joint Quality And Reliability�; John L. Evans and Greg Jones Auburn University; SMTA International; 09/22/2002 * �Process Capability, Wetting Behavior And Temperature Dependent Shear Strength Of Alternative Lead Free Solder Joints�; Th. Herzog , S. Rudolph, and K.-J. Wolter Dresden University of Tech.; SMTA International; 09/22/2002
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