Anyone who has experience on IPC-TM650 environment test 2.6.3.1

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Anyone who has experience in IPC-TM-650 Environment test Met... - Nov 12, 2003 by

Please email us. ... - Nov 12, 2003 by davef

The main function of the test is to evaluate the solder mask... - Nov 17, 2003 by

Henry

#26343

Anyone who has experience on IPC-TM650 environment test 2.6.3.1 | 12 November, 2003

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1?

I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a single strand PTFE insulated wire to each pad of the board. My question is, is there any standard step to do it? what is the purpose/different between solder pot and soldering iron? No need solder wire (63/37)? How to use flux, soldering iron, solder pot and flux to finish this electrical connection?

If I use common solder wire (63/37) to connect insulated wire to board by soldering iron, then is it ok?

I need your help thanks for all reading !

reference link http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2-6_2-6-3-1.pdf

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davef

#26344

Anyone who has experience on IPC-TM650 environment test 2.6.3.1 | 12 November, 2003

Please email us.

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blnorman

#26369

Anyone who has experience on IPC-TM650 environment test 2.6.3.1 | 17 November, 2003

The main function of the test is to evaluate the solder mask.

Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on ONE of the solder mask coated boards. You are supposed to remove the flux used for this.

Connect the wires to the specific pads on the board (dependant on test Class) to apply the test bias voltage. This is where the soldering iron comes in. You don't remove the flux used to solder the wire onto the pad unless you get flux on the test pattern.

Hope this helps some.

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