Advanced electronic assembly convection reflow ovens include a variety of options for cooling product after reflow. The Electrovert Omniflo series ovens include options for internal or external cooling systems.
What are the pros and cons of utilizing these cooling systems and/or external chillers? One obvious benefit would be to cool down the product more quickly for easier and faster handling after reflow. There may well be other benefits in terms of flux management or emmission controls.
A cooling system should provide much more process control in terms of consistancy and repeatability in terms of the cool down rate however there may well be intermetalic migration concerns with how fast a cool down occurs.
If you can add anything to this topic and/or provide experimental data it would be very much appreciated.
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