Pros are no need to clean after reflow. No need to buy a cleaner or worry about "wet" parts afterwards when you're trying to test your unit.
Cons are that most leave a bit of a residue behind. It's harmless but may drive your bed-of-nails tester a bit buggy if your test points are probing the solder joints. If this is your first turn at no-clean, you'll probably notice an increase of solder balls as well. This is because your cleaner washed em off before. The best way around this is to use the standard homeplate design on your R's and Cs. This prevents th paste to squish out under your Rs and Cs, which causes the solder ball. Also, inspectors may see the no-clean residue under magnification, so some training may be needed as well.
Don't forget to switch all your wire solder to no-clean as well! Many forget this step.
Other than, all profiling and repair should be the same as your old paste.
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