I have a QFP 160 used on 9 different products that had high fall out for "Insufficient Solder". Basically, a leg or two would pop free when inspected occasionally. This same part is used on different size products, located at different area of each product. We looked at the boards, the profile, the paste, screen printing parameters etc. and found the only common thing was this same QFP. Looking at the QFP manufacturers web site, we could not get any data sheets on this part. They basically had the IPC/JEDEC J-STD 020C spread sheet showing eutectic assembly versus Pb-free assembly. They do say they went no-lead by 2005, so we figured we should reinvestigate our reflow profile. After raising the liquidous temperature to the Pb-free assembly spec., problem goes away. Now my big problem is I have a quality document that recorded these failures. I submitted that we would adjust for no lead and monitor this part in the future. Most "normal" people would find this satisfying and agree to close this out, but we like to take the New American Approach and make things complicated. By doing so, someone can make others look bad in hopes they look good, climb the wonderful corporate ladder, make billions of dollars and become somebody. It appears one of our non-norms e-mailed the sales guy and when he was told of our findings, danced a jig and said it was no-way his part causing these problems. But this guy apparently stated their parts were still lead plated! I can see they are not, but was wondering if there was a way of really telling?
I�ve tried e-mailing him but now he relies stating he is out of the office till next week.
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