I agree with prior postings, but there is no perfect yes/no answers, right (left)...? Only good questions to be answered. I think it is overkill to have an extra stencil, why do you need it? (That is if you have a proper stencil cleaning equipment). Think about the % of lead (it is not only lead in the RoHS directive, but just a ref. for discussion) that is allowed on the pcba/or the finished product.
We produduce protype RoHS pcba:s and we do the following things at our mixed leaded/RoHS production areas. * Separeted and green marked refigreators for solder paste. * Separeted and green marked inspection and repair areas. * Separeted reflow profiles, that is if yor oven can handle the new RoHS profiles. * Separeted and green marked RoHS Vawe solder machine. * Separeted and green marked RoHS repair solder pot. * Trained and certififed personal for dealing with RoHs production, inspection and repair (they are not green marked... yet). * Separeted and green marked component storage areas and this is by far the most complex things we currently deal with. The MSD levels(Moisture Sensitive Devices) is now a BIG deal. How to handle and keep tracking of the floor life in an efficient way? On this one, i would like to discuess furter, but maybe I should start a new thread? Sorry for my poor english gramma & spelling. Sincerly,
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