We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in copper.
The issues with shrink and stretch in flexible circuits is best delt with by using fiducials on the panel, circuit, and at each critical component location. This approach is discussed further in IPC-2223A - Sectional Design Standard for Flexible Printed Boards.
Yes, applying a rigid backer to an array acts primarily as a carrier/stiffener to improve handling. It is not intended to compensate for stretch or shrink of a flex. The fabricator needs to do an excellent job of securing the entire panel to the backing to prevent variations in placement height accross the panel.
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