Welcome to SMTnet.
Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!!
We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers to bloody stubs figuring-out how to convert them from the older format, but until then the paltry 30 or so threads will be a good point to start.
As you would suspect, the ENIG solderability protection that your supplier proposes is going to make board assembly a wonderful place, tulips won�t be eaten by the deer before they blossom, and the bartenders will start cleaning the glasses down at Jimbo�s. Yippie!!
As with all things, the good brings bad and you just have to balance the trades. As a starting point in understanding those trades, go to http://www.merix.com/, goto the Resource Center, and find "Comparison of Electroless Ni/Immersion Au vs. Electrolytic Ni/Au" and "Alternatives to HASL: Users Guide for Surface Finishes" These papers are fairly unvarnished and will be a good starting point for our conversations.
Ask your supplier to explain the issues surrounding black pad in ENIG, report back, and we'll talk.
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