Bob
Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel:
1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 lb/in. You didn�t talk about the type of board or copper weight, but from the sound of things from you, I doubt the pads on your boards would come anywhere near this. 2 Copper is often plated in multiple processing steps. You should take a tour of you fabricator. It�ll take a half day or so. From the sound of things from you, the two of you will be getting to know each other better, anyhow. 3 You weren�t real clear on the "black particulate material." It could be carbon used in the electroplating process. The copper on the lifted leads is probably a lot "brighter" than you�d expect. 4 You are correct to be concerned. Your fabricator should be concerned also.
my2�
Dave F
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