Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform bonding of 46*46 um pad size with pad pitch of 51 um (distance between pads of 5 um only) of 22nm technology on a 44QCFP package using a diameter wire of 0.5mil and 30um fine pitch capillary. I read the bonding machine manual and followed the steps to teach the machine but I don't know the criteria to specify the bonding parameters. Also, I am currently stuck at the wire threading step through the capillary (It is very hard to thread it through and once I do it and operate the machine it gets cut every time and error message appears). can anyone recommend resources, or training to help complete this task?
Thanks in advance for your help!
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