| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I know we all seek easy/better solutions to apparent problems/issues. I've never seen a need to rotate, at any angle, stencil or board images to effect better prints.
I just haven't seen problems with typical parallel printing. Also, I have seen few, with stencils well designed from qualified suppliers, problems with chemically etched stencil openings for fine pitch, xfinepitch, BGA, and uBGA device types. For me, it all comes down to the right design and process management.
I know this sounds rhetorical, but I've designed and printed for years using chem etching, with laser machining for step downs when required. Electro-polishing is fine, as is electro-forming, but isn't always an answer that works any better for me. I just don't get it when design rules are as they should be.
I'm always willing to try new stuff. I will even try frying pans to effect rework. If it works better, I'll incorporate it into my design rules and process methods, but it has to work. My question is: Does it work and where's the proof it works better before rushing off to do something different?
Earl Moon
reply »