| | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), and how to measure your parameters and keep them under control. It was originally presented last spring at a Multi-core soldering seminar. Hope it helps debug Tony's process. | | | | Now - to continue that discussion on intermetallics - the school of solder metallurgy I grew up in taught me that intermetallics are a must for a strong solder joint - ideally about 10% of the joint when viewed in a cross section. That's all I have to say about it without running the risk of insulting any of our industry's gurus. | | | | | | | | Yep, and the thinner the intermetallic, the better joint you got, right? | | Anyway, Chrys, I tried to go to the library, but your paper is not posted there (URL, or doc file isn't there). I emailed you as well. | Hell, CK. No one gets insulted or pissed off on this forum. We really want to learn through healthy, and sometimes heated, discussions.
I, for one, like your intermetallic learnings and approach. I like thinner IMC formations. I'd still like to know what the "gurus" who taught you and me currently provide as objective evidence as it has changed much over time.
It's just that in this industry very little mone is available for research in the ever changing world of soldering and solder joint formation. Initial quality criteria has changed, just a Scott said, from on of "bright and shiny" to one of, again, ever changing. I'd like to know more based on long term reliability as we venture deeper and deeper into smaller and smaller with the possiblity facing us all about lead free soldering.
Nice posting,
Moonman
reply »