| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run a medium board volume of mixed technology and high product mix. Our current sampling of 3-4 boards per shift is done after Reflow and Wave Solder. Yields are between 80-85%, but that is a representation of the boards sampled and not the process. Any help that would enable us to implement a more effective quality monitoring system would be greatly appreciated.
Mark: You sound like work at a "poster child" company for some quality control guru to make call and come-off looking like a genius. You have lousy yields, do virtually no quality control, and couldn't possibly know if your processes are capable or in control. Get help!!! A guru named Wheeler writes a column on statistical process control in "Quality Magazine" each month. Good luck. Dave F | | Regards, | Mark Milward | |
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