| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? |
Ben,
We use SiPlace platforms, as well.
I'd recommend a two pronged approach to get to the root cause:
1) are you using the proper nozzle for an 0603?
We place 0603s all day long--no problems. We also place 0403s.
2) If the answer to #1 is yes, I'd look at your paste deposition and volume. I can't imagine that if you are using the proper nozzle and have accurate placements that you'd be getting paste in the nozzles, unless your volume / pad size is in left field, and the paste is extruding out from between the terminations and pads.........and even then I wouldn't think that it would happen if the nozzle is centered on the 0603 dielectric surface at pickup.......have you looked at what the boards look like post placement, prior to reflow? Check your paste process and stencil aperture / thickness sizes......
MHO
Scott Cook scottc@t-com.com
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