| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on how to try this | technology out? | Ryan Jennens | Phoenix Engineering Ryan: Two alternatives to overcoming perceived limitations of placing fine pitch components on HASL boards are: 1 West goes East: Roughly conventional board fab process. Placing components on printed paste on alternate finishes (ie, OSP, Ag/Ni, Au flash) on copper pads 2 East goes West: Completely different board fab process. Placing components on a flux on solder coated copper pads, where the solder on the pads have been finished differently than HASL Certainly alternative 1 West goes East has greater acceptance than the other alternative. The technologies you are talking about are proprietary. So you need to find licensees from the folks below. 1 Optipad SMW Electronik Miltec 404.662.5922 John Gregory Colonial Ckts 2 Sipad Siemens 3 Precision Pad Technology Santa Ana CA 714.557.3383 Dave F
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