Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubble-wrap and styrofoam peanuts though. You start out at 40 degrees C, in a oven that has it's humidity controlled at less that 5% relative humidity for 192 hours. Depending on how big the part is, and how much moisture it's absorbed, it could go longer than that...the 192 hours is just a starting point. Be aware that the top film peel-back force on your reeled components is going to increase. Practically every reeled component nowadays uses a thermal adhesive on the top film, and it gets stronger with a 8-day bake at 40 C. Don't go above 45 degrees C in the oven, the adhesive will begin to go bad above that temperature. Actually, if you have the time, and your pick and place machines aren't bothered by the increased peel back force, this is probably the better bake than the one at 125 degrees C. You don't have to worry about ruining the solderabilty at such a low temperature. After the bake you treat these parts the same way you would parts that had the higher temperature bake, as far as the time of exposure to the environment before soldering. I hope this helps ya' out... -Steve Gregory-
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