We experience e-test failure due to BGA problem.
The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn.
If it is due to ESD then it should be a total failure I supposed.
We check the component storage until its use in the line but we couldn't find any MSD handling issue. The reflow profile for this BGA is within the specs. and X-Ray analysis reveals no unusual shape of the balls.
We suspect that there is a contact problem either on the ball-substrate or ball-solder pad. It may be also that something is wrong with the die/chip inside though we could not confirm it.
Has anybody had experience this kind of problem in their facility?
Thanks..
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