Hi you there, Do you have any experience upon the shelf life of PCBA which passed 100 cycles of liquid to liquid thermal stress test, 125 to -35 centigrade for 15 minutes and 5 seconds of transfer time from 125 to -35 centigarde. Will appreciate if any one can provide me the documentation on this issue.
You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment?
Consider using the guidelines in SM-785 "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments" for your particular product environmental use conditions.