Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


what is the different between ENIG and Immersion Au

Views: 3226

#38991

what is the different between ENIG and Immersion Au | 12 January, 2006

Hi,

What is the different between Electroless Nickel / Immersion Gold (ENIG) and Immersion Au. Are they refer to the same finishing?

We has been using the Gold thickness (0.00005 - 0.00013mm) , nicket (0.0025mm) for all Gold finishing brd (Immersion Au and Electrolytic gold). Until the lead free program came in.

The process has face all kind of problem.. like solderibily issue, black spot, etc...

Now the process claim that our Gold thickness is not within IPC spec. And he can't able to provide me more information except mention something like Gold thickness must be 8u" (0.0002032mm)

Does anyone know which IPC spec has information for Gold and Nicket thickness for different finishing.

Thks

reply »

#38996

what is the different between ENIG and Immersion Au | 12 January, 2006

There's a lots comparisons like this on the web. Here's one:

Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no||E-test, ICT, keypad||E-test, ICT, keypad||E-test||E-test, ICT, keypad Wirebond||no||no||Al||Au, Al||no||Au, Al Cost $||1||0.7x||3 x||5 x||0.8 x||0.8 x OEM�s||all||all||most||few||30||150 Fab�s||most||most||200||few||40||250 Reflows||6||2||6||6||2||6 Shelf-Life mos||18 ||6 ||24 ||24 ||6 ||12 Compliant Pin||+||-||-||-||++||+

We have no relationship, nor receive benefit from the company referenced above.

IPC-4552 - Specification for Electroless Nickel/Immersion Gold (ENIG)

reply »

Void Free Reflow Soldering

SMT spare parts - Qinyi Electronics