I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepable/unacceptable? How close can two parts (lands) be situated next to each other without risk of bridging when wave soldered using epoxy deposition on the bottom of the board? ANY help is greatly appreciated.