Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

BGA Qualification

Patrick Wong


BGA Qualification | 9 December, 1999

I am task to qualifiy a process for BGA with 560 bumbs and is 1.3" width and if possible also to determine if nitrogen is necessary. BUT I do not know that are the test required and what standard should I follow. I know I will have to reflow the BGA and X-ray and cross-section. What other test do I have perform to show that there will not be process related problem and reliability

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Flux-Free Reflow Soldering

24h pcb prototype and assembly